Microfabrication of 3D metallic interconnects via direct laser writing and chemical metallization

Abstract

We present a developed method based on direct laser writing (DLW) and chemical metallization (CM) for microfabrication of three-dimensional (3D) metallic structures. Such approach enables manufacturing of free-form electro-conductive interconnects which can be used in integrated electric circuits such as micro-opto-electro-mechanical systems (MOEMS). The proposed technique employing ultrafast high repetition rate lasers enables efficient fabrication of 3D microstructures on dielectric as well as conductive substrates. The produced polymer links out of organic-inorganic composite matrix after CM serve as interconnects of separate metallic contacts; their dimensions are: height 15 μm, width 5 μm, length 35–45 μm, and they could provide 300 nΩm resistivity measured in a macroscopic way. This proves the techniques potential for creating integrated 3D electric circuits at microscale.